Contacts
Address
Malaysia, Selangor, Subang Jaya, Suite B613, 6th Floor, East Wing, Wisma Consplant II No. 7, Jalan SS16/1
Director
Manager
Phones of enterprise
management
+60
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Internet
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About enterprise
Shinkawa (Malaysia), Sdn. Bhd.
Nature of Business
Servicing of equipment for semiconductor industry.
In stock
Features
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High speed bonding of small chips
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Stable thermosonic bonding through newly developed transducer and very precise force control
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Applicable for several types of substrates by replacing conversion parts
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Compact body handles eight-inch...
Group: Special equipment
In stock
Features
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Highly extensible platform capable of handling variety of bumping methods (Gold solder, NCP, Copper Pillar, TSV, COC) realized by adopting the modular system.
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High speed, high accuracy bonding achieved by adopting probe camera technology and Shinkawa NRS...
Group: Special equipment
In stock
Features
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Bumps are formed directly on pre-diced wafer pads using the gold wire ball bonding method.
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Compact machine body handles eight-inch wafers.
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High accuracy bonding achieved by ultra-low- vibration XY linear drive of bonding head with...
Group: Industrial equipment
In stock
Features
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Package sorter for diced solid mold CSP, wafer level CSP Diced packages attached on tape are sorted very quickly in a tray
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Available with a flip mechanism that attaches the ball upside down for live-bug style very quickly - The world highest speed level...
Group: Industrial equipment
In stock
Features
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Super high-precision bonding achieved by adopting high magnification optical probe and linear motor that enabled higher XY table resolution
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Super high-speed vision system and Shinkawa NRS technology allow higher throughput
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Employs...
Group: Special equipment for producing
In stock
Features
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Capable of high speed bonding of 50ms/2mm wire.
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Low inertia realized by the combination of short transducer and bond holder using CRFP(10% lower than conventional type).
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Succeeded in weightsaving of Y motor (50% lighter than conventional type)...
Group: Special equipment for producing
In stock
Features
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Higher accuracy achieved with high precision
bonding head and stabilized die pickup
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Variety of options provide capabilities to run
thin dies and stacked packages for production
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As an option, capable of high force bonding with...
Group: Production equipment
In stock
Features
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Y bonding area of 87mm, applicable lead frame width of 95mm achieved.
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Capable of high speed bonding of 50ms/2mm wire.
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Low inertia realized by the combination of short transducer and bond holder using CFRP, enabling to achieve high speed...
Group: Technological Equipment
In stock
Features
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Best choice for production of low-pin devices such as QFNs.
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Capable of high speed bonding of 50ms/2mm wire.
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Bond inspection Measurement (BIM) System measures the ball diameter and position, and feed back the amount of deviation to the machine....
Group: Technological Equipment
In stock
Features
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Capable of high spees bonding of 50ms/0.7mm wire.(Conventional type speed 65ms/0.7mm)
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Productivity of discrete devices improved by employing Shinkawa NRS tecnology for a high speed XY drive with ultra low vibration.
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Simultaneous detection in X...
Group: Equipment for metal working