MYR
Shinkawa (Malaysia), Sdn. Bhd. in Subang Jaya | Online-store Shinkawa (Malaysia), Sdn. Bhd. Subang Jaya (Malaysia)

Shinkawa (Malaysia), Sdn. Bhd.

+60 (3) 563-756-20
Contacts

Address

Malaysia,  Selangor,  Subang Jaya,  Suite B613, 6th Floor, East Wing, Wisma Consplant II No. 7, Jalan SS16/1

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Manager

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About enterprise

Shinkawa (Malaysia), Sdn. Bhd.

Nature of Business Servicing of equipment for semiconductor industry.
Products and services
Flip Chip Bonder For Discrete Devices, LED, SAW Filter, Quartz Oscillator
In stock 
Features ● High speed bonding of small chips ● Stable thermosonic bonding through newly developed transducer and very precise force control ● Applicable for several types of substrates by replacing conversion parts ● Compact body handles eight-inch...
Group: Special equipment
Flip Chip Bonder
In stock 
Features ● Highly extensible platform capable of handling variety of bumping methods (Gold solder, NCP, Copper Pillar, TSV, COC) realized by adopting the modular system. ● High speed, high accuracy bonding achieved by adopting probe camera technology and Shinkawa NRS...
Group: Special equipment
Bump Bonder
In stock 
Features ● Bumps are formed directly on pre-diced wafer pads using the gold wire ball bonding method. ● Compact machine body handles eight-inch wafers. ● High accuracy bonding achieved by ultra-low- vibration XY linear drive of bonding head with...
Group: Industrial equipment
Package Sorter
In stock 
Features ● Package sorter for diced solid mold CSP, wafer level CSP Diced packages attached on tape are sorted very quickly in a tray ● Available with a flip mechanism that attaches the ball upside down for live-bug style very quickly - The world highest speed level...
Group: Industrial equipment
COF Bonder
In stock 
Features ● Super high-precision bonding achieved by adopting high magnification optical probe and linear motor that enabled higher XY table resolution ● Super high-speed vision system and Shinkawa NRS technology allow higher throughput ● Employs...
Group: Special equipment for producing
Gold Wire Bonder For CSP, BGA, Small Substrate, Leadframe Type ICs
In stock 
Features ● Capable of high speed bonding of 50ms/2mm wire. ● Low inertia realized by the combination of short transducer and bond holder using CRFP(10% lower than conventional type). ● Succeeded in weightsaving of Y motor (50% lighter than conventional type)...
Group: Special equipment for producing
Epoxy Die Bonder
In stock 
Features ● Higher accuracy achieved with high precision bonding head and stabilized die pickup ● Variety of options provide capabilities to run thin dies and stacked packages for production ● As an option, capable of high force bonding with...
Group: Production equipment
Gold Wire Bonder for CSP, BGA, QFN, Leadframe Type ICs
In stock 
Features ● Y bonding area of 87mm, applicable lead frame width of 95mm achieved. ● Capable of high speed bonding of 50ms/2mm wire. ● Low inertia realized by the combination of short transducer and bond holder using CFRP, enabling to achieve high speed...
Group: Technological Equipment
Gold Wire Bonder for QFN,lower pin count ICs,LED
In stock 
Features ● Best choice for production of low-pin devices such as QFNs. ● Capable of high speed bonding of 50ms/2mm wire. ● Bond inspection Measurement (BIM) System measures the ball diameter and position, and feed back the amount of deviation to the machine....
Group: Technological Equipment
Gold Wire Bonder
In stock 
Features ● Capable of high spees bonding of 50ms/0.7mm wire.(Conventional type speed 65ms/0.7mm) ● Productivity of discrete devices improved by employing Shinkawa NRS tecnology for a high speed XY drive with ultra low vibration. ● Simultaneous detection in X...
Group: Equipment for metal working
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A complete range of products and services Shinkawa (Malaysia), Sdn. Bhd.. All information about Shinkawa (Malaysia), Sdn. Bhd. in Subang Jaya (Malaysia).